| abstract |
An epoxy resin composition comprising an epoxy resin, a phenol resin, a curing accelerator, and an inorganic filler as essential components, comprising: a spherical fused silica having a pH of 3 to 5 as a component of the inorganic filler, a eutectic made of silicon dioxide and titanium oxide, Or it provides the epoxy resin composition for semiconductor sealing excellent in fluidity | liquidity and moldability containing the eutectic which consists of silicon dioxide and alumina.n n n Semiconductor, Sealed, Sealed, Epoxy, Silica, Silicon Dioxide, Titanium Oxide |