| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S428-901
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-0008
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-00 |
| filingDate |
1998-01-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2000-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1074d3d3df07f3a173f69ea86f4b4d40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8ff949fd4634a9f07c957eb618674c7b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_663cd9de6b73df4449ec08b251d3d387
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0500a820762e49790fba0a36b493137c |
| publicationDate |
2000-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-100274060-B1 |
| titleOfInvention |
Epoxy resin composition for semiconductor sealing and resin molded type semiconductor device sealed with the epoxy resin composition |
| abstract |
The present invention provides a jet flow maximum value measured according to a method for evaluating the jet flow of an epoxy resin mixture with an epoxy resin composition for sealing semiconductor containing an epoxy resin, a curing agent, and an inorganic filler. Phosphorus J value relates to an epoxy resin composition having 10 to 50. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101317745-B1 |
| priorityDate |
1997-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |