http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101299651-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-312 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-037 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D5-25 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D179-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-00 |
| filingDate | 2010-12-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-08-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2013-08-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101299651-B1 |
| titleOfInvention | Low temperature curable Polyimide resin and method of preparing the same |
| abstract | The present invention In the method for producing a polyimide resin by reacting diamine and dianhydride, a polymer is polymerized in the presence of a solvent having a boiling point of 130 to 180 ° C to provide a polyimide resin capable of low temperature curing in a temperature range of 150 to 250 ° C. The polyimide according to the method of the present invention can be cured even at low temperatures, so that when used as an electronic material, it is possible to minimize equipment damage caused by a high temperature process, and can also be used on a plastic substrate. Do. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20180128828-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102018455-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11248098-B2 |
| priorityDate | 2010-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 171.