http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101260597-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D11-0047 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00 |
| filingDate | 2006-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-05-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2013-05-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101260597-B1 |
| titleOfInvention | Polishing Method for Polishing Metals and Polished Films |
| abstract | (a) the occurrence of abrasive damage resulting from solid particles, (b) the deterioration of flatness such as dicing and erosion, (c) the complexity of the cleaning process to remove abrasive particles remaining on the substrate surface after polishing, (d The present invention solves the problems such as the cost of solid abrasive particles themselves and the cost increase due to waste liquid treatment, and also provides a polishing solution for metals capable of CMP at a high Cu polishing rate and a polishing method using the same. The metal oxidant, the metal oxide dissolving agent, the metal anticorrosive agent, and the weight average molecular weight containing the water-soluble polymer having an anionic functional group of 8000 or more and having a pH of 1 to 3 or less for the metal and the polishing cloth for the polishing plate for the metal. A polishing method for polishing a polishing film, wherein the polishing table and the substrate are relatively operated while the substrate having the polishing metal film is pressed against the polishing cloth while the polishing liquid is supplied. |
| priorityDate | 2005-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 123.