| abstract |
The voltage converter includes an output circuit having an upper side element and a lower side element that can be formed on a single die (power die). The top side device may comprise a lateral diffusion metal oxide semiconductor (LDMOS), while the bottom side device may comprise a planar vertical diffusion metal oxide semiconductor (VDMOS). The voltage converter may further include a controller circuit on another die that is co-packaged with the power die and can be electrically connected.n n n n Lateral diffusion metal oxide semiconductor (LDMOS) devices, semiconductor wafers, vertical diffusion metal oxide semiconductor (VDMOS) devices, first semiconductor dies, second semiconductor dies, co-packaging |