http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101085982-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K10-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-68 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-784 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301 |
| filingDate | 2004-01-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2011-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2011-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101085982-B1 |
| titleOfInvention | Semiconductor device manufacturing method and cutting device for cutting semiconductor wafer |
| abstract | In the plasma dicing process in which the semiconductor wafer 6 is divided into pieces by plasma, the SiO 2 layer 42 and the protective layer 43 formed to cover the active layer 43 form the wafer base layer 40. It is used as an etching stop layer for alleviating the difference of the etching rate in the 1st plasma dicing process of etching and cutting | disconnecting. Next, a second plasma dicing step of cutting the etch stop layer exposed by the first plasma dicing step into a plasma of the second plasma generating gas that can be etched at a high etching rate is performed, and the protective sheet is exposed to the plasma for a long time. It can prevent the heat damage caused whenn n n n Semiconductor, Plasma, Etching, Dicing |
| priorityDate | 2003-01-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 25.