| abstract |
In the bonding method (three-dimensional mounting) of the semiconductor substrate which joins the main surface in which the bump for connection of a silicon wafer was formed, and the main surface in which the pad of another silicon wafer was formed with the adhesive agent apply | coated to at least one among them, the bump and this pad In order to solve the electrical connection defect by the position shift | offset | difference with, this invention performs the positional alignment of the said silicon wafer, and then positions the said connection bump and pad by X-ray etc. which can permeate the said wafer. These positions are adjusted while confirming that the bumps and the pads are bonded by heating and pressing, and the interlayer adhesive supplied between the main surfaces is cured.n n n n Silicon Wafer, Insulation Film, Laminate, Interlayer Adhesive, Electronic Devices |