| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4644
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24917
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09509
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09472
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3457
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S428-901
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-112
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-184
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-072
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0392
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0307 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-384
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-244
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-032
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0388
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-032
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 |
| filingDate |
1997-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2001-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2001-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-100277838-B1 |
| titleOfInvention |
Solder resist composition and printed circuit boards |
| abstract |
An object of the present invention is to propose a solder resist composition which is easy to apply with a roll applicator and little lead movement, and a printed wiring board using the solder resist composition.n n n In order to solve the problem, the present invention includes a acrylate of an novolak-type epoxy resin and an imidazole curing agent, and a soldering resist composition obtained by adjusting the viscosity to 0.5 to 10 Pa · s at 25 ° C using a glycol ether solvent. And a printed wiring board using this soldering resist composition is proposed. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101014986-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101158218-B1 |
| priorityDate |
1996-11-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |