| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-1089 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-321
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76862
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32935
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-285
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76843
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2855
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-3299
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-345
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3205 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-285
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-54 |
| filingDate |
2007-01-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2010-10-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2010-10-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-100987835-B1 |
| titleOfInvention |
Seed film forming method, plasma film forming apparatus and storage medium |
| abstract |
There is provided a method for forming a seed film which can form a seed film without forming an overhang portion. The metal target 70 is ionized by a plasma in the processing container 24 made vacuum suction, and metal ion is produced, and the recessed part 4 is mounted in the surface which mounted the metal ion on the mounting table 34 in a processing container. A seed film deposition method in which a seed film for plating is formed by drawing a metal film on a surface of a workpiece including a recess into a workpiece to be processed with a bias power and forming a recess, wherein the bias power is applied to the workpiece. The film forming step of forming a metal film by setting the metal film once formed on the surface of the metal film to a size at which sputtering is not sputtered and the step of stopping the formation of the metal film without generating metal ions are alternately repeated a plurality of times. |
| priorityDate |
2006-01-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |