http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100967479-B1

Outgoing Links

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-7833
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-146
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-24
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-146
filingDate 2007-12-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2010-07-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2010-07-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-100967479-B1
titleOfInvention Manufacturing Method of Semiconductor Device
abstract The embodiment relates to a method of manufacturing a semiconductor device. The method of manufacturing a semiconductor device according to the embodiment may include forming a gate electrode on a semiconductor substrate, sequentially forming a first oxide film, a nitride film, and a second oxide film on the semiconductor substrate on which the gate electrode is formed. Dry etching the oxide film, wet etching the nitride film, and implanting ions into the semiconductor substrate on which the first oxide film is formed to form source and drain regions on both sides of the gate electrode. When the gate spacer is formed in the semiconductor device, the embodiment may form a residual oxide layer on the silicide layer to prevent plasma damage and leakage current, thereby improving device characteristics of the CMOS image sensor.n n n n Gate spacers, implants
priorityDate 2007-12-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 28.