http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100955860-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0545 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-387 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-182 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1608 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1653 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-2086 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-24 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 |
| filingDate | 2006-02-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2010-05-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2010-05-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100955860-B1 |
| titleOfInvention | Metal pattern formation method |
| abstract | The present invention provides a method for preparing a substrate comprising: (a) forming, on a substrate, a pattern of a polymer layer containing a polymer having a functional group capable of interacting with an electroless plating catalyst or a precursor thereof and directly chemically bonding to the substrate;n n n (b) applying an electroless plating catalyst or a precursor thereof on the polymer layer; Andn n n (c) forming a metal film in a pattern form by performing electroless plating using an electroless plating solution on a substrate having the polymer layer,n n n The substrate having the polymer layer imparted with the electroless plating catalyst or its precursor comprises (c) a surface charge control agent or a plating catalyst poison of 1 × 10 -10 to 1 × 10 -4 mmol / l before or during the formation of the metal film. It provides a metal pattern forming method characterized in that the treatment using a solution to. Moreover, this invention provides the metal pattern obtained by this. The present invention also provides a printed wiring board and a TFT wiring board each using the metal pattern as a conductive layer.n n n Metal pattern formation method, metal pattern, printed wiring board, TFT wiring board. |
| priorityDate | 2005-02-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 257.