| abstract |
(57) [Summary] [PROBLEMS] To eliminate the need for special surface treatment of a polyimide film, to reduce the cost by reducing troublesome work, to control the desired thickness of copper plating, and to achieve high heat resistance and high adhesiveness. Flexible substrate for printed wiring and method of manufacturing the same. A resin composition film for heat-resistant electroless plating that does not require a one-sided or two-sided corrosion step of a polyimide film is formed, and electroless copper plating is performed by each step of film activation, catalyst application, and catalyst activation. Thereafter, a copper plating film is formed to a desired thickness by electrolytic plating. |