http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100889983-B1
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_799858790a0d932d2bf525d1f2324ad6 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67069 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-324 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67103 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065 |
filingDate | 2007-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2009-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_32657fcb6c78522d71e74fc8c2e6b00d |
publicationDate | 2009-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | KR-100889983-B1 |
titleOfInvention | Substrate Processing Apparatus and Method |
abstract | The present invention relates to a substrate processing apparatus and method. The present invention includes a plasma processing module having a first processing module and a second processing module which supply plasma on a substrate and are disposed adjacent to each other, wherein the first processing module is cured of the photoresist film on the substrate on which the ion implantation process is performed. After first removing the surface layer, the second processing module follows the first plasma supply module to secondarily remove the photoresist film from which the surface layer has been removed. |
priorityDate | 2007-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 23.