http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100841038-B1

Outgoing Links

Predicate Object
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-6834
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32532
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-3244
classificationIPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J37-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05H1-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-461
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-78
filingDate 2002-06-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2008-06-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2008-06-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-100841038-B1
titleOfInvention Plasma processing device
abstract In the plasma processing apparatus, as the material of the plasma processing apparatus electrode member 17 mounted on the front surface of the gas supply port of the plasma generating electrode, the ceramic frame portion 18a containing alumina is continuous in a three-dimensional mesh structure. Using the three-dimensional ceramic porous body, the gas for plasma generation is passed through a hole portion 18b irregularly formed in the three-dimensional network structure. Therefore, it is possible to make the distribution of the supplied gas uniform, to prevent abnormal discharge, and to perform uniform etching without variation. n n n n Plasma, semiconductor device, 3D network structure
priorityDate 2001-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5359268
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID14917
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID451818717
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5461123
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419577374
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559541
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID17358
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419491804
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID9989226
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23987
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419527022
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559562

Total number of triples: 39.