http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100779099-B1

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filingDate 2006-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2007-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_537f49527909b7a5869cdef10ef55949
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publicationDate 2007-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-100779099-B1
titleOfInvention Method for manufacturing a phase change memory device comprising a GB chalcogenide pattern
abstract A method of manufacturing a phase change memory device is provided. The present invention includes forming a GST chalcogenide layer used as a phase change material on a semiconductor substrate. A hard mask pattern is formed on the GST chalcogenide layer. A helical plasma dry etching apparatus using a mixed gas of argon gas and carbon tetrafluoride gas as an etching gas, wherein the GST chalcogenide layer is formed by using the hard mask pattern having a high etching selectivity with respect to the GST chalcogenide layer as an etching mask. Dry etching to form a GST chalcogenide pattern. The hard mask pattern may be formed of a titanium nitride pattern.
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priorityDate 2006-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 42.