http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100748239-B1

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classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05B2203-021
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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05B3-14
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-52
filingDate 2006-02-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2007-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b2dba18ce85c71132905a7fb7c5460fc
publicationDate 2007-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-100748239-B1
titleOfInvention Light emitting diode package and manufacturing method thereof
abstract The present invention relates to a light emitting diode package and a method of manufacturing the same, and has the effect of improving the reliability of the package and contributing to the miniaturization of the package.n n n The LED package according to the present invention for this purpose, the LED chip mounted on the lead frame; A wire electrically connecting the LED chip to the lead frame; A first package mold formed on a bottom surface of the lead frame; And a second package mold formed on an upper surface of the lead frame to include the LED chip and the wire and injection molded by mixing a phosphor and a liquid resin.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101027130-B1
priorityDate 2006-02-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 46.