| abstract |
In the composition for removing the insulating material capable of effectively removing the insulating film, the method for removing the insulating film and the method for regenerating the substrate using the same, the composition for removing the insulating material is 5% to 40% by weight of the fluorine compound, 0.01% by weight to the first oxidant 20% by weight, 10% to 50% by weight of the second oxidant and excess pure water. By applying the composition for removing an insulating material to a substrate having a low dielectric constant film and / or a protective film, the low dielectric constant film and / or the protective film can be removed without damaging the substrate, and the substrate can be economically regenerated. |