Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c16d2144a81bfa32a665dca1e93c3d37 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_37eb7cfa3558a58bbb336dd2190e210a |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23G1-106 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D3-3947 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02071 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-3281 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23G1-125 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D11-0047 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D7-08 |
filingDate |
2004-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2006-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_145d41fd269b85351c1df16ffbcf8086 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_78f88fe9476e5ec331515257b62fb8fe http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_093a446753858679319b6cd6cf5e6459 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_acae17e0bfe4d6932cc956dba34127b8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5f5bb1288deff2a4938fc9f36a502e6a |
publicationDate |
2006-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-100606187-B1 |
titleOfInvention |
Semiconductor substrate cleaning composition, semiconductor substrate cleaning method and semiconductor device manufacturing method using same |
abstract |
In a semiconductor substrate cleaning composition having a superior effect of removing impurities remaining on a semiconductor substrate while minimizing damage to a metal layer and an oxide film, a cleaning method using the same, and a method of manufacturing a semiconductor device, the semiconductor substrate cleaning composition is a first chelate in an acidic aqueous solution. It is prepared by adding the first and second chelating agents. After the metal pattern is formed on the semiconductor substrate, the semiconductor substrate cleaning composition may be used to clean the surface of the semiconductor substrate, thereby minimizing damage to the metal layer and the oxide layer and facilitating removal of impurities remaining on the substrate. As a result, defects in the semiconductor device can be prevented and the cleaning time of the semiconductor substrate can be shortened. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101728553-B1 |
priorityDate |
2004-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |