http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100554855-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67126 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S134-902 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67051 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67173 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67161 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6723 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76849 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67219 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67167 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6719 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-001 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate | 1998-09-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2006-06-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2006-06-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100554855-B1 |
| titleOfInvention | Substrate Plating Equipment |
| abstract | The substrate plating apparatus forms an interconnect layer over an interconnection region comprising fine grooves and / or holes formed in the substrate. The substrate plating apparatus includes a plating unit for forming a plating layer on a surface of a substrate including an interconnection region, a chemical-mechanical polishing unit that chemically polishes the substrate to remove the plated layer from the surface of the substrate, leaving a portion of the plating layer in the interconnection region; After forming the plating layer or treating the substrate by chemical mechanical polishing, a cleaning unit for cleaning the substrate, a drying unit for drying the substrate after the substrate is cleaned, and each first plating unit, first chemical mechanical polishing unit, cleaning And a substrate transfer unit for transferring the substrate from and to each of the drying units. The first plating unit, the first chemical mechanical polishing unit, the cleaning unit, the drying unit, and the substrate transfer unit are combined into one single device. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022086186-A1 |
| priorityDate | 1997-09-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 37.