http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100554210-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76811 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76804 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065 |
| filingDate | 1998-09-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2006-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2006-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100554210-B1 |
| titleOfInvention | Dual damascene with self aligned via interconnects |
| abstract | An improved method of performing dual damascene etching on a stacked structure disposed on a substrate using self-aligned vias is disclosed. The laminate structure includes a lower conductive layer and an upper insulating layer overlying it. The method includes the following process steps. A patterned hard resist layer is deposited over the top surface of the insulating layer so that the first opening of the hard resist layer overlies the bottom device layer. Next, a soft resist layer is deposited over the top surface of the hard resist, the soft resist having a second opening smaller than the first opening aligned in line with the first opening and the bottom conductive layer. A trench is then formed in the upper surface of the insulating layer, which is located above the lower device layer and is separated from the lower device layer by an insulating material at the bottom of the trench. Next, the soft resist is removed without substantially affecting the hard resist. Vias are formed by etching the insulating material at the bottom of the trench to the underlying device layer. |
| priorityDate | 1997-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 22.