| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-78603
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-13613
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68363
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68359 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-13454
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76251
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76259
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1266
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-13613
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1214
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-1368
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76254
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-78603 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02F1-1368
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02F1-1362
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-786
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-84
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-762
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-77 |
| filingDate |
1997-08-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2005-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2005-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-100481994-B1 |
| titleOfInvention |
Stripping method, transfer method of thin film device, and thin film device, thin film integrated circuit device and liquid crystal display device manufactured using the same |
| abstract |
A method of transferring a thin film device on a substrate to a transfer body, the method comprising: forming a separation layer on the substrate; forming a transfer layer including the thin film device on the separation layer; Bonding the transfer layer to the transfer member via an adhesive layer; irradiating light to the separation layer to cause peeling at a layer and / or an interface of the separation layer; and removing the substrate from the separation layer. It has a process of leaving. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9010398-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102007834-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20150002959-A |
| priorityDate |
1996-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |