| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2101-36 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-262 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C13-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-26 |
| filingDate |
2001-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2005-01-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2005-01-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-100468213-B1 |
| titleOfInvention |
Solder, method for processing surface of printed wiring board, and method for mounting electronic part |
| abstract |
The solder essentially contains 1.0 to 4.0 mass% Ag, 0.2 to 1.3 mass% Cu and 0.02 to 0.06 mass% Co, and the balance contains Sn and unavoidable impurities. |
| priorityDate |
2000-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |