| abstract |
(57) [Problem] To provide a lead-free solder alloy which does not contain Pb and which retains the properties of a Pb-containing solder alloy as much as possible and which is particularly excellent in thermal fatigue resistance. SOLUTION: Bi 0.1 to 10% by weight, Ag 0.1 to 5 Wt%, Cu 0.055-2 wt%, Ni 0.0005- Lead-free solder consisting of 0.1% by weight, 0.0005 to 0.01% by weight of P and the balance being Sn. Further, a solder alloy obtained by further adding In 0.01 to 0.5% by weight to the above composition. The present invention also includes a cream solder containing the above solder alloy powder, a forming solder using the above solder alloy, and a tinned solder using the above solder alloy. |