http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100460891-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-206 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2201-02 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D179-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1003 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-14 |
| filingDate | 2001-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2004-12-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2004-12-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100460891-B1 |
| titleOfInvention | Novel poly(amide-imide) resins using aromatic dicarboxylic acid and preparation method thereof |
| abstract | The present invention relates to a novel polyamideimide resin with improved processability and a method for producing the same. Specifically, the present invention provides a novel polyamideimide resin excellent in heat resistance, solubility, and insulation by polymerizing aromatic dicarboxylic acid and diamine, and a method for producing the same. The polyamideimide resin of the present invention exhibits excellent dissolution characteristics with respect to organic solvents and dissolves in low polar solvents. In addition, since the polyamideimide resin of the present invention is excellent in heat resistance and insulation, it can be usefully used as a high heat-resistant structural material for core parts of the high-tech industry. |
| priorityDate | 2001-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 60.