http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100396881-B1

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-461
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filingDate 2000-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2003-09-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2003-09-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-100396881-B1
titleOfInvention Wafer polishing slurry and method of chemical mechanical polishing using the same
abstract A slurry used for wafer polishing and a chemical mechanical polishing method using the same are disclosed. One aspect of the present invention, {N- (R 1 R 2 R 3 R 4)} + X - a compound having the shape of a R 1, R 2, R 3 and R 4 is a radical (radical) and X is halogen The slurry which added the tetraammonium compound which is an anion derivative containing an element etc. is provided. Preferably, the ammonium compound is selected from [(CH 3 ) 3 NCH 2 CH 2 OH] Cl, [(CH 3 ) 3 NCH 2 CH 2 OH] I, [(CH 3 ) 3 NCH 2 CH 2 OH] Br, [ (CH 3 ) 3 NCH 2 CH 2 OH] CO 3 or mixtures thereof. The slurry may further include a pH adjuster consisting of a base such as KOH, NH 4 OH or (CH 3 ) 4 NOH, and an acid such as HCl, H 2 SO 4 , H 3 PO 4 or HNO 3 . In addition, the pH adjusting agent may include [(CH 3 ) 3 NCH 2 CH 2 OH] OH. In addition, the slurry may further include a surfactant such as cetyldimethyl ammonium bromide, cetyldimethyl ammonium bromide, polyethylene oxide, polyethylene alcohol or polyethylene glycol.
priorityDate 2000-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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