http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100363366-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2886 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66 |
| filingDate | 1997-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2003-01-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2003-01-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100363366-B1 |
| titleOfInvention | Method and apparatus for testing electrical characteristics of object to be tested |
| abstract | In the case of the conventional inspecting method and inspecting apparatus, as means for removing the insulating oxide film on the electrode pad in order to make the conduction between the electrode pad and the probe needle of the object (for example, an integrated circuit formed on the semiconductor wafer) , An operation of overdrive the main chuck on which the semiconductor wafer is mounted or to remove the oxide film on the wafer by means of the probe by adding fine vibration in the horizontal direction to the main chuck. During the repetition of this operation, the probes are deformed with time, the height of the tip of the probes becomes uneven, and the contact between the probes and the electrode pad becomes unstable, or the fragments of aluminum oxide There is a problem that it is difficult to perform stable and stable inspection.n n n According to the present invention, an insulating oxide film at a portion where at least a measuring contact is brought into contact on the electrode (pl) is removed by vapor-phase processing (for example, plasma treatment) And the electrical characteristics of the object to be inspected are inspected by bringing the measuring contact into contact with the part where the film is removed. |
| priorityDate | 1996-12-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 27.