http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100200911-B1

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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3213
filingDate 1991-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 1999-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bf3cd28385cfe8410ff5564320c21293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_88abf9869853471a9b134122cd71559b
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publicationDate 1999-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-100200911-B1
titleOfInvention Method for making conductive layer and structure for ultra high density integrated circuit and apparatus for implementing the method
abstract In a method of making a conductive layer or structure for an ultra-high density integrated circuit, at least two process steps are carried out directly in the various chambers 1 to 6 of the high vacuum equipment without interrupting the high vacuum conditions for the semiconductor substrate. Avoiding exposure to air between process steps substantially delivers better layer properties and enables a simple and reliable multi-step method for producing a conductive layer that preferably supports multi-layered metal wiring on a semiconductor substrate. The apparatus used consists of a plurality of high vacuum process chambers 1 to 6, at least one high vacuum distribution chamber 7 connecting the process chambers, and at least two high vacuum supply chambers for the semiconductor substrate.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100367455-B1
priorityDate 1990-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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