http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2020012959-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
| filingDate | 2019-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-06-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2020012959-A1 |
| titleOfInvention | Board processing method and board processing equipment |
| abstract | The step of removing the solidified film by vaporizing the solidified film by heating the solidified film covering the uneven pattern formed on the substrate, and the step of removing the solidified film heats the solidified film. A step of forming an irradiation point of a laser beam to be formed on the substrate or the solidified film to form an exposed portion exposed from the solidified film of the uneven pattern, and moving the position of the irradiation point on the substrate or the solidified film. A substrate processing method including a step of enlarging the exposed portion by means of. |
| priorityDate | 2018-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 40.