| abstract |
Provided is a resin composition which is excellent in various properties such as flame retardancy, circuit embedding property, handling property (flexibility), and can bring about a significantly low dielectric loss tangent. This resin composition comprises a predetermined high-viscosity resin (A) having a viscosity at 120° C. of 8000 Pa·s or more, a predetermined low-viscosity resin (B) having a viscosity at 120° C. of less than 8000 Pa·s, and the following formula: : [Chemical 1] (In the formula, n is 3 or 4) And a filler (D) which is an organic filler or an inorganic filler. |