| abstract |
Provided is a curable resin composition that gives a cured product having a low dielectric constant and dielectric loss tangent, has excellent moldability at a normal press molding temperature, and further provides a cured product having excellent heat resistance and adhesiveness. To do. The present invention relates to a curable resin composition comprising a polyphenylene ether (A), a cross-linkable curing agent (B), and a phosphorus-containing flame retardant (C), the average phenolic property per molecule of the polyphenylene ether. The number of hydroxyl groups is 0.3 or more, the resin flow amount during curing of the curable resin composition is 0.3% or more and 15% or less, and the dielectric loss tangent at 1 GHz: 0.007 or less, and the glass transition A curable resin composition that provides a cured product having a temperature of 160 ° C. or higher is provided. [Selection figure] None |