| abstract |
A uniform underlayer film can be formed, excellent in wettability, an imprint underlayer film forming composition and an imprint curable composition kit, and a laminate using the kit, a laminate, Provided are a manufacturing method, a method for manufacturing a cured product pattern, and a method for manufacturing a circuit board. A kit having a curable composition for imprinting and a composition for forming an underlayer film for imprinting; the composition for forming an underlayer film for imprinting contains a solvent in a proportion of 99.0% by mass or more; curable composition for imprinting The surface tension of the product and the surface tension of the non-volatile component in the composition for forming an underlayer film for imprint satisfy a predetermined relationship; the component of the non-volatile component has a boiling point exceeding 300 ° C. and is a liquid at 23 ° C. |