| abstract |
In one embodiment of the present invention, a method of manufacturing an electronic component comprises: forming a first metal layer on a substrate; forming a second metal layer on the first metal layer; and forming a second metal layer on the second metal layer. A mask made of an organic resin layer is formed, and the second metal layer is plasma-etched using a reaction gas containing fluorine through the mask to laminate the organic resin layer and the second metal layer. A recess is formed in the film, the inner surface of the recess is subjected to oxygen ashing treatment, and after the oxygen ashing treatment, a third metal layer is formed in the recess by electrolytic plating treatment. |