http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2018159384-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L25-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-023 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-023 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-037 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L25-18 |
| filingDate | 2018-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2019-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2018159384-A1 |
| titleOfInvention | Resin composition, resin sheet, cured pattern, semiconductor electronic component or semiconductor device |
| abstract | (A-1) an alkali-soluble polyimide resin having a glass transition temperature of 200 ° C. or more and 300 ° C. or less, (a-2) an alkali-soluble polyimide having an glass transition temperature of 50 ° C. or more and 150 ° C. or less, and an alkali-soluble polybenzoxazole; A resin composition containing at least one resin selected from an alkali-soluble polyamideimide, a precursor thereof, and a copolymer thereof, and (b) a photosensitizer, wherein the component (a-1) is 100 parts by mass. A resin composition containing the component (a-2) in an amount of 10 parts by mass or more and 40 parts by mass or less based on parts. According to the present invention, even if the maximum temperature of the heat treatment step for curing is 150 ° C. or more and 220 ° C. or less, the obtained cured film has low stress, and the shape change of the cured pattern in the subsequent solder reflow step. Can be obtained. |
| priorityDate | 2017-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 541.