http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014137434-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_129e393582e6bdf4029baf2206522f45 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-023 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 |
| filingDate | 2013-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b792326c4f9de8ad0f01acfb1217943c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_de77b6414ab71678bdbe43429ec5e574 |
| publicationDate | 2014-07-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2014137434-A |
| titleOfInvention | Positive photosensitive resin composition |
| abstract | A positive photosensitive resin composition having excellent adhesion to copper and a copper alloy is provided. (A) The sum of the general formula (1) and the general formula (2) is 50% or more of the total number of structural units, the number of structural units represented by the general formula (1) is p, and the general formula Including q, the number of structural units represented by (2), p / (p + q) = 0.60-0.95, (b) a quinonediazide compound, (c) a thermal crosslinking agent and (d) a solvent A positive photosensitive resin composition. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2018159384-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7059927-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018159384-A1 |
| priorityDate | 2013-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 129.