http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2018025655-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-14 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02 |
| filingDate | 2017-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2019-06-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2018025655-A1 |
| titleOfInvention | Concentrated solution for silicon wafer rough polishing composition |
| abstract | The present invention provides a concentrated solution of a silicon wafer rough polishing composition which can exhibit good polishing performance after dilution and which is excellent in stability. The concentrate of the composition for roughly polishing a silicon wafer provided by the present invention contains an abrasive, a basic compound and a water-soluble polymer. The ratio [rg / d] of the radius of inertia rg [nm] of the water-soluble polymer to the interparticle distance d [nm] of the abrasive grains in the concentrate is 4.7 or less. |
| priorityDate | 2016-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 114.