http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2016088743-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-46 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-092 |
| filingDate | 2015-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2017-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2016088743-A1 |
| titleOfInvention | Resin sheet and printed wiring board |
| abstract | A resin sheet comprising a resin composition that can be used as an insulating layer in printed wiring board materials, has excellent adhesion between the insulating layer and a conductor layer formed on the surface thereof, and has a low coefficient of thermal expansion when fully cured. obtain. The resin sheet is a resin sheet including an outer layer that is any one kind selected from the group consisting of a polymer film, a metal foil, and a metal film, and an insulating layer laminated on the outer layer, the insulating sheet The layer is a resin sheet containing an epoxy compound (A), a cyanate ester compound (B), aminosilane-treated silica (C), and an acid-soluble inorganic filler (D). |
| priorityDate | 2014-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 93.