| abstract |
(57) [Problem] To provide a multilayer wiring board using an insulating adhesive excellent in workability and excellent in heat resistance and connection reliability, and a method of manufacturing the same. In a multilayer wiring board using a resin not containing a reinforcing material in the form of a woven fabric or a nonwoven fabric as an insulating adhesive layer at the time of multilayering between wiring surfaces of at least two or more different substrates, the composition of the resin is as follows. a. An epoxy group-containing acrylic rubber, b. Epoxy resin and its curing agent, c. A high molecular weight component compatible with the epoxy resin and having an average molecular weight of 30,000 or more; d. A curing accelerator, wherein the cured insulating adhesive has an elastic modulus of 1400 MPa or less at 25 ° C. and a thermal expansion coefficient in a thickness direction of 450 ppm or less. |