| abstract |
When bonding substrates, the generation of voids between the substrates is prevented, and distortion is suppressed, and bonding is performed with high positional accuracy. A method for bonding a first substrate and a second substrate, wherein water or an OH-containing substance is attached to the surfaces of the respective bonding surfaces of the first substrate and the second substrate. And the first substrate and the second substrate are arranged with the bonding surfaces facing each other, and the first substrate is centered with respect to the outer peripheral portion of the bonding surface. A step of bending so that a portion protrudes toward the second substrate side, a step of abutting the bonding surface of the first substrate and the bonding surface of the second substrate between the central portions, In a state where the central portions are in contact with each other with a pressure maintaining a non-bonded state, the distance between the outer peripheral portion of the first substrate and the outer peripheral portion of the second substrate is reduced, and the bonding surface of the first substrate is reduced. Butting work to butt the joint surface of the second substrate with the entire surface When method of bonding substrates to each other with a. [Selection] Figure 4 |