abstract |
According to the present invention, a step (A) for obtaining a resin composition by mixing the following compound (a), the following compound (b) and a polymerization catalyst, and a step (B) for injecting the resin composition into a mold And a step of polymerizing the resin composition by raising the temperature of the heat medium in a heat medium containing a liquid having a thermal conductivity of 0.2 W / m · K or more, or in a shower thereof (C And a method for producing a cured episulfide-based resin in which the maximum temperature of the heat medium in the step (C) is 55 to 110 ° C. (A) Compound having two episulfide groups in the molecule represented by the following formula (1) (B) Compound having one or more thiol groups in one molecule |