| abstract |
The present invention contains an epoxy resin, an aromatic amine compound, and at least one compound selected from the group of compounds having a structural moiety represented by the following general formula (I) as a curing accelerator. A resin composition for electronic parts is provided. Wherein, L 1 represents a carbon atom, a divalent group consisting of a hydrogen atom and an oxygen atom, or a divalent hydrocarbon group. R 1 to R 3 each independently represents a monovalent group, a monovalent hydrocarbon group, or hydrogen composed of one or more atoms selected from the group consisting of a carbon atom, a hydrogen atom, an oxygen atom, and a sulfur atom. Indicates an atom. R 4 to R 7 are each independently a monovalent group composed of one or more atoms selected from the group consisting of a carbon atom, a hydrogen atom, an oxygen atom and a sulfur atom, a monovalent hydrocarbon group, a hydroxyl group, Or a hydrogen atom is shown. Two groups selected from R 4 to R 7 may be bonded to each other to form a ring. |