| abstract |
A liquid resin composition for electronic parts that can reduce the curing temperature without generating voids by increasing the gel time, and the reliability (moisture resistance, temperature cycle resistance) sealed thereby is high. An electronic component device is provided. A liquid for electronic parts containing (A) a liquid epoxy resin, (B) a liquid aromatic amine, and (C) a compound having a structure represented by the following general formula (I) in the molecule as a curing accelerator. Resin composition. R 1 and R 5 are each independently a divalent hydrocarbon group having 1 to 18 carbon atoms, and R 2 to R 4 are each independently a hydrogen atom or a monovalent hydrocarbon group having 1 to 18 carbon atoms. It is. [Selection figure] None |