| abstract |
According to the present invention, a highly reliable semiconductor device with improved moisture resistance reliability is provided. The epoxy resin composition for semiconductor encapsulation according to the present invention includes a semiconductor element mounted on a lead frame or circuit board having a die pad part, an electrical joint provided on the lead frame or circuit board, and the semiconductor element. It is used to manufacture a semiconductor device by sealing a metal wire that electrically joins an electrode pad provided. The said epoxy resin composition for semiconductor sealing contains an epoxy resin (A), a hardening | curing agent (B), and an inorganic filler (C), The said epoxy resin (A) is based on the area method of a gel permeation chromatograph. The area of the main peak in the measurement is 90% or more with respect to the total area of all peaks. |