http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2011152364-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D175-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-306 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-794 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-6208 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-69 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D179-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D109-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-728 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-345 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D179-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D5-25 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G18-65 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L47-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D109-00 |
| filingDate | 2011-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2013-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2011152364-A1 |
| titleOfInvention | Modified polyamideimide resin, electrical insulating material, method for improving dielectric breakdown resistance of insulating layer, and insulated wire |
| abstract | The method for improving the dielectric breakdown resistance of an insulating layer according to the present invention is a method for improving the dielectric breakdown resistance of an insulating layer provided on a conductor, and the conductor is selected from the following first group and second group. The insulating layer is formed by applying and baking an electrically insulating material containing at least one modified polyamideimide resin. First group: Modified polyamideimide resin obtained by reacting a tricarboxylic acid anhydride or a derivative thereof with a diisocyanate compound or a diamino compound in the presence of at least one polybutadiene resin or a hydrogenated product thereof. Second group: Modified polyamideimide resin obtained by mixing at least one polybutadiene-based resin or a hydrogenated product thereof and a polyamideimide resin. |
| priorityDate | 2010-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 141.