| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-14 |
| filingDate |
2004-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4c2f54ec90213325864b01a6ebdce6a9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8be5d40be765d58ff4c9a911a81b780b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ad6f9b43df72204aed30eeea18d012ef
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_58bf144d95f450b087e47cc969f93afe |
| publicationDate |
2006-02-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2006052318-A |
| titleOfInvention |
Thermosetting resin composition and resin varnish using the same |
| abstract |
PROBLEM TO BE SOLVED: To use a thermosetting resin composition capable of forming a printed wiring board capable of sufficiently reducing transmission loss particularly in a high frequency band and sufficiently strengthening an adhesive force between an insulating layer and a conductor layer, and the same A resin varnish is provided. SOLUTION: The thermosetting resin composition of the present invention that solves the above problems has (A) component; polyamideimide, and (B) component; a functional group that can react with the amide group of the polyamideimide, And a compound having an ethylenically unsaturated bond. [Selection] Figure 3 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015084329-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2011152364-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007305957-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2011152364-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2008004399-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I548676-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102918084-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I585133-B |
| priorityDate |
2004-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |