| abstract |
An electronic device that joins the first terminal of the first electronic component and the second terminal of the second electronic component using solder to electrically connect the first electronic component and the second electronic component. A method of manufacturing an apparatus, wherein a resin layer having a flux action is disposed between the first terminal and the second terminal, and the first electronic component, the second electronic component, and the resin layer A step of obtaining a laminate including: a solder joining step of soldering the first terminal and the second terminal; and curing the resin layer while pressurizing the laminate with a pressurized fluid. A method of manufacturing an electronic device that performs a pressure curing step is provided. |