| abstract |
A stud bump structure, a package structure thereof, and a manufacturing method of the package structure are provided. A stud bump structure, a package structure thereof, and a method of manufacturing the package structure are provided. The stud bump structure has a first chip and a silver alloy stud bump installed on the substrate, the silver alloy stud bump on the chip has 0.01 to 10 wt% of Pd, and the balance is Ag. is there. The package structure further includes a substrate having on-substrate bonding pads that are electrically connected to the on-chip silver alloy stud bumps by flip chip bonding. [Selection] Figure 7 |