| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2848
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83191
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2887
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-302
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2312-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-385
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-27
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-83
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J4-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67132
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-066
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-08 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J4-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 |
| filingDate |
2007-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2011-02-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-WO2009050786-A1 |
| titleOfInvention |
Pressure-sensitive adhesive, pressure-sensitive adhesive sheet, multilayer pressure-sensitive adhesive sheet, and electronic component manufacturing method |
| abstract |
The multilayer pressure-sensitive adhesive sheet 100 includes a base film 106, a pressure-sensitive adhesive layer 103 obtained by applying a pressure-sensitive adhesive having a specific composition to the base film 106, and a die attach film laminated on the pressure-sensitive adhesive layer 103. 105. The multilayer pressure-sensitive adhesive sheet 100 using the pressure-sensitive adhesive having this specific composition is excellent in holding ability of the die chip 108 when the silicon wafer 101 is diced, and the multilayer pressure-sensitive adhesive sheet 100 is not easily detached from the ring frame 102 when the silicon wafer 101 is diced. The die attach film 105 and the pressure-sensitive adhesive layer 103 can be easily separated during the pick-up operation 108. |
| priorityDate |
2007-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |