http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2009011304-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31551 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31609 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31605 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-124 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-285 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4246 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-42 |
| filingDate | 2008-07-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2010-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2009011304-A1 |
| titleOfInvention | Thermosetting resin composition |
| abstract | [Solution] The thermosetting resin composition according to the present invention contains a resin (A) containing two or more carboxyl groups and having a polyurethane structure, and a pKa of 10.0 to 14 as a curing accelerator (B). 0.0, a strongly basic nitrogen-containing heterocyclic compound, and a curing agent (C). The cured product of the thermosetting resin composition is used as an insulating protective film such as a printed wiring board, a flexible printed wiring board, or a chip-on film. According to the thermosetting resin composition of the present invention, low temperature curability and immediate curability are improved, tack-free can be realized, low warpage and electrical insulation can be achieved at the same time, and a curing furnace can be achieved by outgassing during heating. It is possible to form an excellent cured product and an insulating protective film, and to form a solder resist and an insulating protective film with low cost and high productivity. Moreover, the electronic component which provided the outstanding characteristic can be supplied using this composition. |
| priorityDate | 2007-07-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 108.