http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2005104638-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0264 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1152 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-381 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4661 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 |
| filingDate | 2005-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2008-03-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2005104638-A1 |
| titleOfInvention | Wiring board and manufacturing method thereof |
| abstract | Provided are a wiring board having high adhesion between a substrate and a conductive layer, and a method for manufacturing the wiring board. A transfer sheet having a concavo-convex surface with a predetermined surface roughness is formed integrally with the substrate so that the concavo-convex surface is transferred to the substrate surface, and then the transfer sheet is removed from the substrate to perform the first roughening treatment. . Next, a second roughening process is performed in which the substrate surface roughened by the first roughening process is chemically roughened by using an etchant. Next, a conductive layer is formed on the substrate surface that has been subjected to the first and second roughening treatments, preferably by an additive method. |
| priorityDate | 2004-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 27.