http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2004114388-A1

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filingDate 2004-06-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2006-08-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-WO2004114388-A1
titleOfInvention Manufacturing method of semiconductor device
abstract A method of manufacturing a semiconductor device includes a step of forming a fluid film made of an insulating substance having fluidity on a substrate, and a surface of the fluid film by pressing a flat pressing surface of a pressing member against the fluid film. The surface is flattened by solidifying the fluid film whose surface is planarized by heating the fluid film to the first temperature with the pressing surface pressed against the fluid film. A step of forming a solidified film; a step of forming a fired film having a flat surface by heating the solidified film having a flat surface to a second temperature higher than the first temperature and firing the solidified film; It has.
priorityDate 2003-06-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 28.